SAN JOSE: Unisem Advanced Technologies (UAT) has announced plans to be distended its wafer bumping capacity at its factory in Ipoh, Malaysia. UAT, which is a joint venture of Unisem, FlipChip International and AdvanPack Solutions, is a hew packing and test facility.

According to details released in the annunciation, the floor space at the Malaysian bumping facility will be increased through 100 percent. Sources say that the equipment to help the spreading will be in place and available for use in September 2010.

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The company says that they overwhelming interrogation from customers for wafer bumping during the upsurge in the sedulousness gives them the impetus to go in for such an distension.